Mounting Procedure
Pulsar Microwave Corporation recommends that our surface mount (SMT) components be mounted using a controlled amount of solder with a specific temperature reflow pattern. A common technique used for applying solder is to print a pattern of solder paste on the PC board (called a solder mask). Dimensions for such solder masks for all of our SMT packages can be found on our website. Once solder is applied, the SMT units are placed on the exact location where they are to be mounted. Then, by using a controlled temperature reflow pattern defined by the recommended mounting temperature profile (see below), a reliable connection will be obtained.
There are many techniques available for applying the heat needed for mounting SMT components. Vapor phase, infrared, wave soldering and hand soldering are all acceptable for use with Pulsar's SMT products. However, regardless of which heating technique is employed, it is critical that all surfaces be free of contaminants before mounting to assure a reliable connection.
Mounting Temperature Profile
