Mounting Procedure
Pulsar Microwave Corporation recommends that our
surface mount (SMT) components be mounted using a controlled
amount of solder with a specific temperature reflow pattern.
A common technique used for applying solder is to print
a pattern of solder paste on the PC board (called a solder
mask). Dimensions for such solder masks for all of our
SMT packages can be found in our catalog. Once solder
is applied, the SMT units are placed on the exact location
where they are to be mounted. Then, by using a controlled
temperature reflow pattern defined by the recommended
mounting temperature profile (see below), a reliable connection
will be obtained.
There are many techniques available for applying the heat needed
for mounting SMT components. Vapor phase, infrared, wave soldering
and hand soldering are all acceptable for use with Pulsar's SMT
products. However, regardless of which heating technique is employed,
it is critical that all surfaces be free of contaminants before
mounting to assure a reliable connection.
Mounting Temperature Profile
